The
AP family of lithography systems provides leading-edge technical
performance and enhanced productivity for advanced packaging customers.
Designed to optimize productivity for advanced wafer fabs, the AP
family integrates the processing advantages associated with
Ultratech's industry-leading advanced packaging lithography equipment
with the productivity benefits of the company's new Unity PlatformTM.
Ultratech's AP300/AP200 support a lower cost-of-ownership strategy
due to significant throughput enhancements, higher reliability, and
superior alignment and illumination systems. In addition, utilizing
non-contact 1X projection imaging technology greatly reduces the
risk of lithography-related yield losses, while also providing the
unique capabilities required for processing leading-edge advanced
packaging devices.
Key Features and Benefits:
- Broadband illumination capability
enables exposure of i-, gh- and ghi-line resists
- Patented Machine
Vision System (MVS) capability eliminates the need for dedicated
alignment targets and simplifies process integration
- Fully automatic
wafer change supports 200 mm and 300 mm wafers
- Improved wafer
edge exposure and wafer edge exclusion capability provide customer
productivity enhancements
- Industry’s
best equipment uptime along with self diagnostic capability and
enhanced host communications
- New platform enables
a 20% productivity improvement, thereby supporting a lower cost-of-ownership
strategy
AP GOLD & AP PLATINUM
The new 200mm Unity GOLD and 300mm Unity PLATINUM lithography
systems were developed to deliver cost- effective solutions for
advanced packaging foundry applications. These low-risk manufacturing
solutions provide the cost-of-ownership (CoO), operational flexibility
and technical performance essential for Ultratech's global customers.
These products, built on Ultratech's highly successful and customizable
Unity Platform™, represent a tangible solution to address
market conditions witnessed by the leading wafer foundry customers.
Unity GOLD provides 150- and 200mm wafer packaging solutions for
flat panel display (FPD) driver chip applications, while the Unity
PLATINUM lithography system provides 200- and 300mm wafer processing
capabilities for high-volume advanced packaging chip manufacturing.
Key Features and Benefits:
- Broadband illumination
capability enables exposure of i-, gh- and ghi-line resists
- Patented
Machine Vision System (MVS) capability eliminates the need
for dedicated alignment targets and simplifies process integration
- Fully
automatic wafer change supports 200 mm and 300 mm wafers
- Improved
wafer edge exposure and wafer edge exclusion capability provide
customer productivity enhancements
- Industry’s
best equipment uptime along with self diagnostic capability
and enhanced host communications
- New platform enables
a 20% productivity improvement, thereby supporting a lower
cost-of-ownership strategy
Prisma-ghi
Ultratech's Prisma-ghi stepper is designed specifically
to address a broad range of technology requirements for the nanotechnology,
MEMS and advanced packaging research and development communities.
The Prisma-ghi incorporates many of the same features as the Unity
steppers, but does so with consideration for smaller, cost conscious
research or limited volume manufacturing facilities.
The Prisma-ghi is based on the production proven Star 100 product
platform and utilizes a 1X broadband optical system, which provides
the ability to expose i-, gh- and ghi-line resist on the same
tool. An optional illumination filter allows the selection of
the desired exposure wavelength. In addition to superior imaging
characteristics, this tool retains the small footprint and flexibility
advantages associated with the Star 100 product platform. The
broadband exposure capability, patented Machine Vision alignment
System (MVS), dynamic focus capability and low initial system
cost make this stepper an intelligent solution for any new or
existing MEMS or wafer bumping R&D fab.
Key Features and Benefits:
- Broadband illumination capability
enables exposure of i-, gh- and
ghi-line resists on the same
lithography tool
- Machine Vision
System (MVS), a pattern recognition-based
alignment system, eliminates
the need for dedicated alignment
targets and simplifies process
integration
- Large depth of focus
capability enables superior image
performance for both thick and
thin resist film
- 100, 125, or
150 mm wafer size handling capability
with less than 30 minute wafer
size change time
Advanced Packaging Products
AP300
AP200
Prisma-ghi |
