NanoTech
160
The NanoTech 160 is Ultratech's second-generation dual side alignment (DSA) stepper
utilizing Direct Vision technology. The NanoTech 160 is specifically designed
for applications where exposing both the front and backside of the wafer is necessary.
Based on its patented Machine Vision System (MVS), Direct Vision incorporates
an alignment system capable of aligning to targets on the back of the wafer while
exposing features on the front. The NanoTech 160 offers valuable process enhancement
features, including a robotic wafer handler, pre-aligner and chuck exclusively
designed to handle dual side resist coated wafers with no backside contamination.
The handling system is designed to support substrate thicknesses up to 1.2 mm
thick and unique software and hardware features have been developed to address
the requirements of extremely thick resist processes. In addition, a Windows
based PC controller offers increased flexibility through a variety of alignment
and focus options for improved process performance for dual side alignment applications.
Key Features and Benefits:
- Front and backside alignment
capability
- Non-contact lithography
- Ability to place
multiple lithography layers on a single reticle
- Pattern recognition
alignment system (MVS) eliminates the need for dedicated targets
- High
wafer plane irradiance
- Simple integration
with existing processes
- Compact system
footprint
- A proven projection
lithography platform in semiconductor, thin film head and microsystems
production environments
NanoTech 190
The NanoTech 190 continues the Ultratech tradition of providing
superior application-specific products with low cost of ownership
advantages. Building on the proven success of the Model 1700 and
1900 family, the NanoTech 190 is essential to the development of
smaller dimension thin film head devices. The NanoTech 190 introduces
a new theta stage design for improved accuracy and repeatability.
Ultratech's patented Machine Vision System (MVS), designed especially
for Femto sized rowbars, offers improved alignment capability.
A Windows based PC controller offers a touch screen interface and
increased flexibility in networking options. The system is available
in two resolution lens options, 1.0 µm and 2.0 µm,
addressing a wide range of air-bearing surfaces (ABS) design requirements.
Key Features and Benefits:
- Custom "rowbar" application
hardware and software options
- Non-contact lithography
- Ability to place
multiple lithography layers on a single reticle
- High wafer plane
irradiance
- Compact system
footprint
- A proven stepper
platform in high volume thin film head production
Nanotechnology Products
NanoTech 160
NanoTech 190
NanoTech 100 |
