2008 | 2009 | 2010 | 2011

Ultratech Articles 2011

“The most recent advance in thermal processing equipment for semiconductor wafer manufacturing is millisecond annealing, which can be accomplished by two very different approaches—laser spike annealing or flash lamp annealing—each with its own application-dependent benefits and tradeoffs……”

Click on the link to see full online coverage: Laser Focus World June, 2011

Technology Considerations for Cost Effective HBLED Manufacturing 
Manish Ranjan, Ultratech Inc.
Chip Scale Review Tech Monthly Feature Article

“Over the last several years, we have witnessed a steady increase in the adoption of high-brightness, light-emitting diodes (HBLED) chips for several end market applications. While demand was initially driven by display chips, the pull for using HBLED chips for solid-state lighting applications is on the rise. It is anticipated that solid-state lighting will play a significant role in realizing global energy cost savings within the next several years. However, manufacturing cost reductions are critical to ensure wide spread adoption of solid-state lighting….”

Click on the link to see full online coverage: Chip Scale Review June 2011

Millisecond annealing: extendible to 20nm and beyond
Jeff Hebb, VP of Laser Product Marketing at Ultratech, Inc.
Industry Forum – Solid State Technology

“The most recent advancement in thermal processing equipment is millisecond annealing (MSA), where the wafer is typically brought to temperatures about 100-200°C below the melting point of silicon for 100s of microseconds to several milliseconds….Today, MSA is considered mainstream in logic manufacturing for 45nm and below for ultra shallow junction formation, often used for multiple steps in the process flow.  To extend MSA to 20nm and beyond, there are challenges in both device integration and the manufacturing process….”

Click on the link to see full online coverage: Solid State Technology May, 2011

LSA for 28nm HB-LEDs
Product News – Solid State Technology

“The LSA101 laser spike annealing system has been upgraded to enable critical millisecond annealing applications for the 28nm node and beyond. New coherent optics generate a longer, more focused laser beam at the wafer plane, enabling up to 200% increased throughput vs. the LSA100A model…..”

Click on the link to see full online coverage: Solid State Technology March, 2011

Ultratech Sapphire 100 Lithography system
Product Preview for SEMICON China 2011

“The Sapphire 100 is Ultratech’s latest lithography solution for cost-effective, high-brightness light-emitting diode (HBLED) manufacturing. Building upon the cost and performance advantages of the company’s highly reliable 1500 platform, the Sapphire 100 system incorporates several market-specific technology options required for HBLED manufacturing….” 

Click on the link to see full online coverage in Chinese: Semiconductor International, China Magazine February 21, 2011

“Laser annealing of ultrashallow junctions is one of those technologies that’s been talked about for years, but has been slow to actually reach manufacturing floors. As with many such technologies, though, the semiconductor industry’s needs seem to be catching up with laser annealing’s capabilities. Scott Zafiropoulo, VP of Marketing at Ultratech, said that 2010 was a strong year for laser annealing, with mass adoption and multiple system orders for production at the 45 nm and smaller nodes……”

Click on the link to see full online coverage: Semi Manufacturing and Design, February 19, 2011

“Lithography is one of the critical processes affecting overall LED device yield and performance, but the use of 1X steppers provides significantly better technology and economic advantages for high-volume manufacturing environments….”

Click on the link to see full online coverage: Solid State Technology Magazine, February 2011

Korean Semiconductor Companies – Positioned for Growth
Arthur W. Zafiropoulo, Chairman & CEO, Ultratech, Inc.

“With leadership positions in TSV for advanced packaging, laser annealing for advanced logic devices and now memory, and HB-LED manufacturing, Ultratech provides low cost, advanced technology solutions.  By leveraging its global technology leadership and enhanced infrastructure in Korea, the company remains true to its commitment to deliver competitive advantages in lithography and laser processing systems, which add great value to help enable their customers’ business success……”

Click on the link to see full online coverage in Korean: Electronic Parts & Components (EP&C Korea) January, 2011

"Historically, companies transitioned from the 45nm node and then slipped into the 40nm node. At 32nm, they shifted into 28nm, and for 22nm, they seem to be migrating into the 20nm node. As a result, I envision the device landscape as both 20 and 22nm. For the most part, metal gate structures will be more prevalent than silicon gate structures for the 20/22nm technology node. The most interesting question is whether it will be "metal gate first" or "metal gate last."...

Click on the link to see full online coverage: Solid State Technology January, 2011

Ultratech Articles 2010

Market and technology trends in advanced packaging
Manish Ranjan, Vice President, Advanced Packaging Technology/Nanotechnology Market at Ultratech

"In addition to eutectic flip chip bumping, a number of new bumping technologies including copper pillar, lead free solder and 3D packaging technologies such as fan-out wafer-level packaging and through silicon via (TSV) are being developed to meet future device packaging requirements. This article discusses some of the market and technology trends along with key lithography challenges for advanced wafer bumping applications."

Click on the link to see full online coverage: Semiconductor International April, 2010

2010 Executive Outlook: Cautious Optimism Emerges
By Semiconductor International Staff

“In the calm after the perfect storm of a worldwide economic dislocation and one of the industry's severest downturns, industry leaders are cautiously optimistic as they look forward to the twin promise of better economic times and growth. Ultratech Chairman and CEO Arthur W. Zafiropouloand other industry luminaries offer their perspectives on 2010.”

Click on the link to see full online coverage: Semiconductor International January, 2010

Ultratech Articles 2009

Ultratech, Inc. Rings The NASDAQ Stock Market Opening Bell
By Staff

"Chairman and CEO, Arthur W. Zafiropoulo, opened the NASDAQ stock market on Wednesday, October 21, 2009 at 9:30 a.m. EDT at the NASDAQ MarketSite located at 4 Times Square in New York City.  Following the opening of the NASDAQ stock market, Ultratech hosted its sixth annual Analyst Day event at the NASDAQ MarketSite from 10:30 a.m. to 1:00 p.m. EDT.  Zafiropoulo and members of the company's management team delivered key presentations regarding Ultratech's business.  A replay of the audio webcast of the meeting is available on Ultratech's website at: 
http://ir.ultratech.com/events.cfm." 

NASDAQ MarketSite October 21, 2009

Click on the link to see the video of Ultratech opening the NASDAQ stock market:
http://mktvideo.nasdaq.com/MarketSiteOpenCloseVideos/200910/mo_102109.wmv
Video is © 2009, The NASDAQ OMX Group, Inc.

Melt LSA at sub-16nm, readying move to FinFETs
By Debra Vogler, Senior Technical Editor

"As the semiconductor equipment industry looks ahead to what it hopes will be a much better economic picture going forward than in the past year or so, Ultratech's chairman/CEO/president, Art Zafiropoulo, updated SST on the company's strategy and focus. Jeff Hebb, Ultratech's VP of marketing for laser processing technology, focused on the advantages of LSA technology to address leakage issues at July's AVS West Coast Junction Technology Group Meeting......"

Click on the link to see the full Article: Solid State Technology, Online Exclusive Feature, August 2009

Die-scale stress management to advanced annealing optimization
By David M. Owen, Jeff Hebb, Ultratech Inc.

"This contributed article by David Owen and Jeff Hebb discusses the issues around stress management. Transistor-scale engineering of stress is being widely adopted in the effort to achieve performance targets for advanced technology nodes. Stress management on larger scales is often overlooked. This may be due to the limitations of traditional stress metrology, which is typically unable to characterize within-die and die-to-die stress variations on patterned wafers. The research described in this article addresses these issues...."

Click on the link to see the full Article: Solid State Technology, September 2009

Talking 3D with Manish Ranjan
Françoise von Trapp, industry commentator, blogger, "Queen" of 3D IC integration and 3D packaging

"I'll never forget the first time I interviewed Manish Ranjan of Ultratech. It was during my first SEMICON West experience in 2006. Between 2006 and 2007, I learned a lot, and by the time we met again, this time as part of the AP Roadshow, I could hold my own in the interview. Those annual chats have become a personal benchmark of how much I have learned. But I also look forward to them because Manish provides a great supplier-side perspective of what's going on in the back-end sector of industry......"

Click on the link to see the full blog post: 3D InCites August 17, 2009

Sneak preview: LSA for sub-45nm devices
Video Interview by Debra Vogler, Senior Technical Editor

“Jeff Hebb of Ultratech talks about extending laser spike annealing to the 22nm node, the topic of a paper he's presenting at the NCCAVS Junction Technology Group meeting to be held Thursday, July 16 in San Francisco.”

Click on the link to see the full video interview: Solid State Technology July 14, 2009

Executive Roundup: On the Path to a New Semi Industry
By Semiconductor International Staff

“Massive fallout from the financial crisis and the prolonged downturn will lead to an emergence of a new semiconductor industry. Executives within the semiconductor industry offer their views on what topics and technologies will be highlighted at this year’s SEMICON West. Arthur W. Zafiropoulo, Ultratech Chairman and CEO, noted that the entrepreneurial spirit should be alive and well in the area of green technologies at SEMICON West……..”

Click on the link to see full article: Semiconductor International Mid-June, 2009

“Silicon Valley is being adversely affected by U.S. policies on taxation and immigration, said Ultratech CEO Art Zafiropoulo at a recent SEMI event. “There is something essentially wrong with a policy that forces educated people to leave and makes it easy for the uneducated to stay,” he said.

Click on the link to see full article: Semiconductor International Online Top Story for April 27, 2009

“At today’s well-attended Silicon Valley Lunch Forum, organized by the Sales and Marketing Council of SEMI, three speakers addressed the question of the future of Silicon Valley. “It is not the product, or the pricing or the support that has been key to the development of the Valley, but the networking opportunities,” declared Art Zafiropoulo, chairman and CEO of lithography tool maker Ultratech.”

Click on the link to see full article: Beta Sights, BetaBlog for April 23, 2009

Innovative Advanced Packaging Technologies Enable Leading-edge Wireless Products
By Manish Ranjan, Ultratech Inc.

“This contributed article by Manish Ranjan of Ultratech explains how innovative solutions such as fan-out wafer-level packaging (WLP) technology deliver robust packaging solutions to meet the performance and reliability requirements for wireless chips. The article discusses the key demand drivers and packaging technology requirements for the mobile market segment.”

Click on the link to see full article: Advanced Packaging E-newsletter March 18, 2009

Gone Fishing
By Gail Flower, Editor-in-Chief

“After editing this forecast issue of Advanced Packaging, it became evident that other industry leaders might also enjoy fishing. Though orders for new equipment and materials haven’t been cancelled, many programs have stalled, particularly ones from financially strapped memory makers. Manish Ranjan of Ultratech added that despite global economic events, the outlook for advanced packaging applications remains relatively bright, what with the fast adoption of flip chip packaging and commercialization of fan out wafer-level packaging.”

Click on the link to see full online coverage: Advanced Packaging Magazine January/February, 2009

Weathering the Storm Together
By Gail Flower, Editor-in-Chief

“What were the most significant technological advancements in our industry in 2008?  Every year Advanced Packaging pans the industry to get a wide-spectrum view of what to expect from the coming year. Without a doubt, these are economically challenging times by all perspectives in this Forecast. Manish Ranjan of Ultratech offers his insight along with other leading executives regarding their perspectives.”

Click on the link to see full online coverage: Advanced Packaging Magazine January/February, 2009

“In the uncertainty of the global economic crisis, cost cutting and collaborative R&D are means to safely navigate the current financial storm. Arthur W. Zafiropoulo, Chairman and CEO, Ultratech Inc. and other industry luminaries offer their perspectives on 2009.”

Click on the link to see full online coverage: Semiconductor International January, 2009

Recessions: a potent time for R&D
By Pete Singer,Editor-in-Chief

“Indeed, the silver lining of this downcycle-combined-with-unprecedented-global-financial-crisis is that it provides a time to regroup, rethink and, yes, even invest. Arthur W. Zafiropoulo, Chairman & CEO, Ultratech, Inc., San Jose, CA, perhaps said it best: “Chip companies will not buy tools to increase capacity,” he said. “Instead…companies will spend money on breakthrough technology that enables them to manufacture devices at advanced nodes when the recovery arrives.”

Click on the link to see full article: Solid State Technology January, 2009

“Technology-driven growth is still possible in the current downturn, according to SST’s poll of executives from across the semiconductor manufacturing supply chain. Even during an economic slump, they remain optimistic about two things: the continuing need to innovate, and the inevitable upturn.”

Click on the link to see full article: Solid State Technology January, 2009

LSA at 32nm and beyond: Ultratech sees a bright future
Debra Vogler, Senior Technology Editor

“USJ formation at 32nm was the focus of the West Coast Junction Technology Group's meeting at this year's SEMICON West, but many presenters also discussed what lies ahead at the 22nm node. Ultratech execs Art Zafiropoulo and Jeff Hebb provide additional insight to SST about the company's WCJTG talk on laser spike annealing.”

Click on the link to see full online coverage: Solid State Technology August, 2008

IC Industry Profile: Arthur W. Zafiropoulo
By Craig Addison, SEMI Editor

“Written in Chinese language, the article includes SEMI’s interview with Arthur W. Zafiropoulo, Chairman and CEO of Ultratech, which provides an historical perspective on this industry luminary and the semiconductor market.”

Click on the link to see full online coverage: Semiconductor Magazine, China September, 2008

“To strengthen and broaden its annealing technology capability for ultra-shallow junction (USJ) formation, a critical step in semiconductor manufacturing, San Jose-based semiconductor manufacturing lithography tool company Ultratech, Inc., said today it has acquired the rights to a collection of patents from IBM Corp that cover fundamental technology for rapid thermal annealing.”

Click on the link to see full online coverage: Semiconductor International October 9, 2008

Ultratech Articles 2009

BetaBlog – Thursday, April 23, 2009 – SEMI Forum
Elizabeth Schumann, Principal Analyst and blogger

“At today’s well-attended Silicon Valley Lunch Forum, organized by the Sales and Marketing Council of SEMI, three speakers addressed the question of the future of Silicon Valley. “It is not the product, or the pricing or the support that has been key to the development of the Valley, but the networking opportunities,” declared Art Zafiropoulo, chairman and CEO of lithography tool maker Ultratech.”

Click on the link to see full article: Beta Sights, BetaBlog for April 23, 2009

Innovative Advanced Packaging Technologies Enable Leading-edge Wireless Products
By Manish Ranjan, Ultratech Inc.

“This contributed article by Manish Ranjan of Ultratech explains how innovative solutions such as fan-out wafer-level packaging (WLP) technology deliver robust packaging solutions to meet the performance and reliability requirements for wireless chips. The article discusses the key demand drivers and packaging technology requirements for the mobile market segment.”

Click on the link to see full article: Advanced Packaging E-newsletter March 18, 2009

Gone Fishing
By Gail Flower, Editor-in-Chief

“After editing this forecast issue of Advanced Packaging, it became evident that other industry leaders might also enjoy fishing. Though orders for new equipment and materials haven’t been cancelled, many programs have stalled, particularly ones from financially strapped memory makers. Manish Ranjan of Ultratech added that despite global economic events, the outlook for advanced packaging applications remains relatively bright, what with the fast adoption of flip chip packaging and commercialization of fan out wafer-level packaging.”

Click on the link to see full online coverage: Advanced Packaging Magazine January/February, 2009

Weathering the Storm Together
By Gail Flower, Editor-in-Chief

“What were the most significant technological advancements in our industry in 2008?  Every year Advanced Packaging pans the industry to get a wide-spectrum view of what to expect from the coming year. Without a doubt, these are economically challenging times by all perspectives in this Forecast. Manish Ranjan of Ultratech offers his insight along with other leading executives regarding their perspectives.”

Click on the link to see full online coverage: Advanced Packaging Magazine January/February, 2009

“In the uncertainty of the global economic crisis, cost cutting and collaborative R&D are means to safely navigate the current financial storm. Arthur W. Zafiropoulo, Chairman and CEO, Ultratech Inc. and other industry luminaries offer their perspectives on 2009.”

Click on the link to see full online coverage: Semiconductor International January, 2009

Recessions: a potent time for R&D
By Pete Singer,Editor-in-Chief

“Indeed, the silver lining of this downcycle-combined-with-unprecedented-global-financial-crisis is that it provides a time to regroup, rethink and, yes, even invest. Arthur W. Zafiropoulo, Chairman & CEO, Ultratech, Inc., San Jose, CA, perhaps said it best: “Chip companies will not buy tools to increase capacity,” he said. “Instead…companies will spend money on breakthrough technology that enables them to manufacture devices at advanced nodes when the recovery arrives.”

Click on the link to see full article: Solid State Technology January, 2009

“Technology-driven growth is still possible in the current downturn, according to SST’s poll of executives from across the semiconductor manufacturing supply chain. Even during an economic slump, they remain optimistic about two things: the continuing need to innovate, and the inevitable upturn.”

Click on the link to see full article: Solid State Technology January, 2009

LSA at 32nm and beyond: Ultratech sees a bright future
Debra Vogler, Senior Technology Editor

“USJ formation at 32nm was the focus of the West Coast Junction Technology Group's meeting at this year's SEMICON West, but many presenters also discussed what lies ahead at the 22nm node. Ultratech execs Art Zafiropoulo and Jeff Hebb provide additional insight to SST about the company's WCJTG talk on laser spike annealing.”

Click on the link to see full online coverage: Solid State Technology August, 2008

IC Industry Profile: Arthur W. Zafiropoulo
By Craig Addison, SEMI Editor

“Written in Chinese language, the article includes SEMI’s interview with Arthur W. Zafiropoulo, Chairman and CEO of Ultratech, which provides an historical perspective on this industry luminary and the semiconductor market.”

Click on the link to see full online coverage: Semiconductor Magazine, China September, 2008

“To strengthen and broaden its annealing technology capability for ultra-shallow junction (USJ) formation, a critical step in semiconductor manufacturing, San Jose-based semiconductor manufacturing lithography tool company Ultratech, Inc., said today it has acquired the rights to a collection of patents from IBM Corp that cover fundamental technology for rapid thermal annealing.”

Click on the link to see full online coverage: Semiconductor International October 9, 2008